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Assist. Mostafa Eid Abd El maboud Ahmed :: Publications:

Title:
Thermal, Electrical Conductivity and CTE Of CF Reinforced Al Composites Fabricated By Hot Compaction
Authors: Mostafa Eid; Saleh Kayetbay; Omayma Elkady; Ahmed El-Assal
Year: 2021
Keywords: Carbon Fiber, Aluminium composites, Powder metallurgy, Surface modifications, Thermal conductivity, Coefficient of thermal expansion
Journal: INTERNATIONAL JOURNAL OF SCIENTIFIC & TECHNOLOGY RESEARCH
Volume: 10
Issue: 01
Pages: 122-134
Publisher: Not Available
Local/International: International
Paper Link:
Full paper Mostafa Eid Abd El maboud Ahmed_Thermal-Electrical-Conductivity-And-Cte-Of-Cf-Reinforced-Al-Composites-Fabricated-By-Hot-Compaction.pdf
Supplementary materials Not Available
Abstract:

Powder metallurgy technique was used to develop carbon fiber reinforced aluminium composites. By enhancing the wettability between CF and Al matrix through surface coating with a thin layer of nano Cu by the electroless plating technique. Two series of samples are prepared from 0,5,10,15 wt% CF/Al composites. For comparison, one of them was prepared from uncoated sample CF and the other group from Cu-coated ones. Both groups are fabricated by a uniaxial hot-pressing technique under 700 MPa and 500℃. The effects of reinforcement weight fraction and reinforcement coating on microstructure, density, electrical resistivity, thermal conductivity and coefficient of thermal expansion were studied. The results revealed that the density and CTE were decreased while both electrical and thermal conductivities were improved by increasing CF percent. Harmful AL4C3 was absent in all produced composites and no intermediate compounds were detected in coated composites. The Cu coating process was an effective way to improve the interfacial structure. The values of electrical and thermal conductivities of coated composites were higher than those of the uncoated composites, and CTE was reduced to 11.98 k^ (-1) at 15 wt.% Cu-coated CF/Al composite, which is suitable for semiconductor in electronic packaging applications.

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